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'''Direct bonding''', or '''fusion bonding''', is a [[wafer bonding]] process without any additional intermediate layers. It is based on chemic These requirements are specified for the wafer surface as sufficiently clean, flat and smooth. Otherwise unbonded areas so ...

...nness or [[Impurity|impurities]]. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors. ...ameters: bond strength, [[Hermetic seal|hermeticity]] of encapsulation and bonding induced stress.<ref name="KGH+2010" /> ...

...include: bulk micro-machining, surface micro-machining, [[LIGA]], [[wafer bonding]], etc. * Wax/[[Parylene]] bonding<ref>{{cite journal|last=Arnold |first=D.|author2=B. Bowers |author3=N. Wang ...

...llows definition of the vertical pump design parameters. Additionally, the bonding layer might be affected by the pumped medium. ...

SHJ cells generally consist of an active [[crystalline silicon]] absorber [[Wafer (electronics)|substrate]] which is passivated by a thin layer of hydrogenat ...con thin film heterojunction structure.png|thumb|A monocrystalline silicon wafer coated with a thin film of amorphous silicon (not visible). Such an amorpho ...

Because of the strong covalent carbon–carbon bonding in the sp² configuration, carbon nanotubes are chemically inert Arrays of top-gated CNTFETs can be fabricated on the same wafer, since the gate contacts are electrically isolated from each other, unlike ...

* The development of frame-to-hull bonding methods in GRP ships. The project enabled the construction of {{HMS|Wilton * Applied Microengineering Limited. In-situ aligned wafer bonding machines and services<ref name="N056"/> ...

...on (phase transition)|sublime]]. The gaseous elements then condense on the wafer where they react with each other to form [[single crystal]]s. Due to the weak van der Waals bonding, which relaxes the lattice-matching condition, TI can be grown on a wide va ...

...me of solid phases, which have both [[Electronics|electronic]] and [[Ionic bonding|ionic]] [[conductivities]]. In electrochemical supercapacitors, the charge ...to the tape, the tape is positioned on a clean substrate such as a silicon wafer or film. The tape with the graphene is pressed gently onto the substrate to ...

...D counterparts due to a shift from covalent/ionic bonding to van der waals bonding.<ref name="auto6"/> Furthermore, increasing the number of subunits “n” from ...for medium scale manufacturing, for instance, for standalone modules or Si wafer-scale integration. This work shows that through judicious selection of a gr ...