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...title=Compression strength formula for corrugated boxes|journal=Paperboard Packaging |volume=48 |issue=8 }}</ref> This used the board ECT, the MD and CD flexura [[Category:Materials testing]] ...

...n in the manufacturing processes, and the reaction of product elements and materials to loads (stressors) and interaction under loads and their influence on the ...tnaik%20-%20Life%20Evaluation%20and%20Extension%20Program.pdf, Gas Turbine Materials/Components Life ...

...18th International Symposium of the Packaging and Transport of Radioactive Materials (PATRAM) held in [[Kobe]], [[Hyōgo Prefecture|Hyogo]], [[Japan]] where the ...

...d material properties that make them suitable for [[packaging and labeling|packaging]], [[insulation (electric)|insulation]], and other applications. ...bone, antlers, and shells have strong materials housing weaker but lighter materials within. Bones tend to have compact, dense external regions, which protect t ...

...ebsite |url=http://www.schott.com/advanced_optics/english/products/optical-materials/thin-glass/foturan-2/index.html ...e pulsed UV nanosecond laser processing of photostructurable glass ceramic materials|journal=Applied Surface Science|date=2005|volume=247|issue=1–4|page=527|doi ...

...aw of endurance test". Proceedings of the American Society for Testing and Materials. 10: 625–630.</ref> and takes the form: ...Solder Interconnections, Proceedings of the TMS, [[The Minerals, Metals & Materials Society]], Orlando, Florida, February 1997.</ref><ref>Darveaux, R. (2000) E ...

...circuitries to form a system. This would be the interfacing circuitry and packaging for the device to become useful. ...B. C.|author2=B. J. Kelley|title=Measurement with a VSM – Permanent Magnet Materials}}</ref> its volume and position from the coils all contribute to its effect ...

...s enable the determination of the bond strength.<ref name="Cui2008" /> The packaging [[hermeticity]] is characterized using membrane, He-leak, resonator/pressur [[Infrared]] (IR) void imaging is possible if the analyzed materials are IR transparent, i.e. [[silicon]]. This method gives a rapid qualitative ...

{{Short description|Materials' resistance to heat transfer}} ..., these principles find applications in a multitude of fields, including [[materials science]], [[mechanical engineering]], [[electronics]], and [[energy manage ...

}}</ref> Typical materials used to make the adhesive include: These materials often are blended with a [[tackifier]] to produce permanent tack (“grabbing ...

...direct bonding as a wafer bonding technique is able to process nearly all materials, '''''silicon''''' is the most established material up to now. Therefore, t ...-end CMOS processing and the beginning of interactions between the applied materials.<ref name="BSY+2004" /> ...

[[Polymer|Polymeric]] materials have widespread application due to their versatile characteristics, cost-ef ...improved dye adhesion before printing text and images on plastic packaging materials. The hazardous nature of remnant ozone after corona treatment stipulates ca ...

...The main component of OP-2 gel is gasoline. On the cardboard or cardboard packaging of the OP-2, the inscription "H.A." refers to its unit component, aluminum ...itorial expansion of imperial Japan, forced it to be replaced by synthetic materials. ...

...ent of Defense}} It also specifies procedures to assess the performance of materials to extreme [[Structural load#Environmental loads|temperature loads]].{{sfn| ...extended.{{sfn|Pentium Processor Packing Identification Codes|ps= Intel's packaging indicates the processors operating temperature range by denoting it with a ...

...discharge. In the 1980s, there was increasing interest in high-performance materials and other scientific issues, and in induction plasma for industrial-scale a ...al, high power plasma applications (30~250&nbsp;kW), tubes made of ceramic materials are typically used.<ref>United States Patent 5200595</ref> The ideal candid ...

{{Main|Open Packaging Conventions}} [[Image:Open Packaging Convention.png|220px|thumb|right|Container structure of Part 2 of the Ecma ...

...nd Si surface energy on the misorientation angle of crystal planes|journal=Materials Science - Poland|year=2006|volume=24|issue=4|pages=1110}}</ref> ...xide has a polar character, adhesion problems can manifest between the two materials. When photoresist does not adhere properly, features lose resolution. Photo ...

...re needed which require energy and can also lead to quicker degradation of materials. Membraneless fuel cells offer a solution to these problems. ...ith decreasing size (see Scaling Laws) which is disadvantageous. Efficient packaging methods and/or self-pumping cells (see Research and Development) need to be ...

...ming health benefits of smaller portions or environmental benefits of less packaging.<ref name="Goldcore">{{cite news |title=ECB Meets To Tackle Deflation While # Product improvements (e.g. improved or updated packaging, larger size or lower price) are very apparent to consumers without being w ...

...sources, there was limited cycle development. There were also worries that materials would be downcycled. Non-renewable miles will become inherently unsustainab #Certification of the '''Recycle Content'''. It is necessary to discern materials that are in a product, especially if they are supposedly recycled or able t ...