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...n be structured via [[ultra-violet|UV]]-exposure, tempering and [[Etching (microfabrication)|etching]]: Crystal [[nucleation]] grow in Foturan when exposed to [[ultrav After [[Etching (microfabrication)|etching]], a [[ceramization]] of the entire substrate after a 2nd [[ultra- ...

...n removing select portions of [[thin films]] used in [[microfabrication]]. Microfabrication is the production of parts on the micro- and nano- scale, typically on the ...ace.<ref>{{cite book|last=Pabo|first=E.F.|title=2011 IEEE 13th Electronics Packaging Technology Conference |chapter=Advances in spray coating technologies for M ...

...d electro-mechanical devices or structures are constructed using special [[Microfabrication|micro-fabrication techniques]]. These techniques include: bulk micro-machin ...circuitries to form a system. This would be the interfacing circuitry and packaging for the device to become useful. ...

...s enable the determination of the bond strength.<ref name="Cui2008" /> The packaging [[hermeticity]] is characterized using membrane, He-leak, resonator/pressur ...ing/ |title=Why test bonds? |first=Bob |last=Sykes |publisher=Global SMT & Packaging magazine |date=June 2010}}</ref> ...

[[Category:Packaging (microfabrication)]] ...