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...ual metrology''' refers to methods to predict the properties of a [[Wafer (electronics)|wafer]] based on machine parameters and sensor data in the production equi ...seppe|date=2015-01-01|title=Multi-step virtual metrology for semiconductor manufacturing: A multilevel and regularization methods-based approach|journal=Computers & ...

...nputs are at the same voltage), the output should be zero. However, due to manufacturing process, the differential input transistors of real op-amps may not be exac ...r.com/10.1007/978-3-030-81119-8_32 |work=International Youth Conference on Electronics, Telecommunications and Information Technologies |volume=268 |pages=317–325 ...

...locity, and ''d'' is the laser beam spot diameter.<ref>{{Cite book|title = Manufacturing Processes for Engineering Materials|last = Kalpakjian|publisher = Prentice ...g processes. It is used in the automobile, shipbuilding, aerospace, steel, electronics, and medical industries for precision machining of complex parts. ...

...and the physical characteristics of the product and their variation in the manufacturing processes, and the reaction of product elements and materials to loads (str ...ability and the physics of failure program at RADC”, Physics of Failure in Electronics, 1963, pp. 4–10; Spartan.</ref> ...

...m was sufficiently bonded to the copper substrate.<ref>{{Cite book|title = Manufacturing Processes for Engineering Materials (5th Ed.)|last = Kalpakjian|first = Ser | title = Manufacturing Processes and Materials (4th illustrated ed.) ...

...y [[environmental tests|environmental testing]] for products, particularly electronics, to evaluate resistance to [[corrosion]] due to gases in the atmosphere. Mi ...xed Gas Environments|journal=IEEE Transactions on Components, Hybrids, and Manufacturing Technology|volume=13|issue=1|pages=40–45|doi=10.1109/33.52847}}</ref>  Othe ...

...T.; Kim, M.J.; Jung, B.H.; Kook, N.P.; Park, I.Y.; Ahn, J.U.; ''Method for manufacturing high-purity gold with low-purity gold'', K.R. Patent 2,009,031,006, 2009.</ ...

...ement and size also by a factor of 10. It achieves these things through a manufacturing process known as [[rapid thermal processing]] (RTP) that uses ultrafine lay | title = WHAT'S NEWS: A review of the latest happenings in electronics ...

...urther shrinking the design nodes and topology of semiconductor transistor manufacturing. ...ture capital investment in [[design for manufacturability (IC)|design for manufacturing]] start-up companies.<ref name="DylanMcGrathDFM2005">{{Citation | last = Mc ...

...for its low loss characteristic. According to Stephen Lampen of [[Belden (electronics company)|Belden]] Wire & Cable, 75&nbsp;Ω was chosen as the nominal impedan ...icant. The reason for this is that equally spaced errors introduced by the manufacturing process will cancel and be invisible, or at least much reduced, at certain ...

...Flex HDI – Via Formation, Structuring, Routing |publisher= LPKF Laser and Electronics |date= 2002 |access-date=20 July 2014}}</ref><ref>{{cite conference | last1 ...rids, and Manufacturing Technology | publisher=Institute of Electrical and Electronics Engineers (IEEE) | volume=13 | issue=4 | year=1990 | issn=0148-6411 | doi=1 ...

...arge carrier]]s in a [[semiconductor]], especially in [[silicon]] [[Wafer (electronics)|wafers]].<ref name=":1">{{Cite journal |last1=Bielle-Daspet |first1=D.M. | ...in either quasi-[[Transient response|transient]] or quasi-[[Steady state (electronics)|steady-state]] photoconductance (QSS-PC) measurements. ...

...rsolutions.com/hubfs/Resources/services/Temperature-Cycling-and-Fatigue-in-Electronics-White-Paper.pdf</ref> driven due to [[temperature]] cycling.<ref>Wunderle, Historically, tin-lead solders were common alloys used in the [[electronics industry]]. Although they are still used in select industries and applicati ...

===Manufacturing=== Sprays are used extensively in manufacturing.<ref>G.G. Nasr, A.J. Yuhl, L. Bendig, Industrial Sprays and Atomization, 20 ...

...brid" approach is lower overall system costs, avoiding the distribution of electronics. ...el performance, due to dirt, differential aging or tiny differences during manufacturing, can result in the array as a whole operating away from its best MPPT point ...

...s due to the chip's different operational schemes and operation [[Trimmer (electronics)|trimming]] of its analog parts. ...attention to self-heating effects. However, due to technology scaling and manufacturing variations, power dissipation within a single production lot of devices can ...

...c random-access memory|static RAM]]) memory cell is a type of [[flip-flop (electronics)|flip-flop]] circuit, typically implemented using MOSFETs. These require ve But memory is a key element of [[Digital electronics|digital systems]]. In computers, it allows to store both programs and data ...

...eyrat|first3=F.|last4=Labouré|first4=E.|title=The Current Sensors in Power Electronics, a Review|journal=EPE Journal|date=1 February 2001|volume=11|issue=1|pages= ...last3=Woodward|first3=R. C.|last4=Borle|first4=L. J.|title=2008 IEEE Power Electronics Specialists Conference |chapter=Theoretical and practical analysis of a cur ...

...patents. Over time, this group created some of the earliest standards for electronics components. In 1936, the RMA adopted a preferred-number system for the res ...ce for establishing common standards across many industries, especially in electronics, where it was essential to produce large quantities of standardized electro ...

*[[Printed electronics]] ...usually results from the [[thermal expansion]] (thermal stress) during the manufacturing process. Thermal stress occurs because film depositions are usually made a ...