File:Thermal strain in thin films.png

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    Summary

    Description
    English: Compressive stress is developed when the thermal expansion coefficient of the film is less than that of the substrate. Tensile stress is developed when the thermal expansion coefficient of the film is greater than that of the substrate.
    Date
    Source Own work
    Author AliyaK13

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    Captions

    Compressive stress is developed when the thermal expansion coefficient of the film is less than that of the substrate. Tensile stress is developed when the thermal expansion coefficient of the film is greater than that of the substrate.

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    1 June 2025

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    Date/TimeThumbnailDimensionsUserComment
    current05:07, 2 June 2025Thumbnail for version as of 05:07, 2 June 20251,215 × 669 (60 KB)wikimediacommons>AliyaK13Uploaded own work with UploadWizard

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