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- '''Vapor etching''' refers to a process used in the fabrication of [[Microelectromechanical ...oi=10.1007/s11249-005-5088-1|s2cid=49385010 |issn=1023-8883}}</ref> Vapor etching overcomes stiction because no liquids are used during the etch process. Com ...11 KB (1,622 words) - 15:27, 22 August 2024
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- ...e of the stencil for etching (if the membrane material is sensitive to the etching process) or a conductive layer on the backside of the stencil for ion impla ===Etching=== ...6 KB (832 words) - 07:41, 21 December 2024
- ...an adjustment factor related to the substrate's index of refraction. The [[etching]] pattern is composed of "periods" – identical sub-pattern units that repea ...profile within the unit period, which can involve many (not less than two) etching transitions of varying duty cycles. ...5 KB (749 words) - 18:00, 9 June 2024
- {{Short description|Manufacturing process using etching chemicals to remove material}} {{Redirect|Industrial etching||Etching (disambiguation)}} ...12 KB (1,741 words) - 05:16, 24 November 2024
- '''Vapor etching''' refers to a process used in the fabrication of [[Microelectromechanical ...oi=10.1007/s11249-005-5088-1|s2cid=49385010 |issn=1023-8883}}</ref> Vapor etching overcomes stiction because no liquids are used during the etch process. Com ...11 KB (1,622 words) - 15:27, 22 August 2024
- * the prediction of layer width in [[Etching (microfabrication)|etching]].<ref>{{Cite book|last1=Susto|first1=G. A.|last2=Johnston|first2=A. B.|las ...3 KB (382 words) - 23:18, 24 November 2023
- ...oturan demonstrator in different processing steps (UV-exposure, tempering, etching, ceramization)]] ...a [[ultra-violet|UV]]-exposure, tempering and [[Etching (microfabrication)|etching]]: Crystal [[nucleation]] grow in Foturan when exposed to [[ultraviolet|UV] ...14 KB (1,963 words) - 05:00, 12 May 2024
- ...lation, plasma [[activation]], and plasma [[coating]].<ref name=Pykonen /> Etching or ablation is when material is removed from the surface of the solid. Plas ...12 KB (1,725 words) - 14:00, 3 May 2024
- ...ion]], destruction of gaseous organic waste, [[Etching#Photo-etching|photo-etching]] and photo-deposition and more other applications.<ref name=eryuklj /> ...hoto-degradation of a variety of pollutants. [[Etching#Photo-etching|Photo-etching of polymers]] is possible using different wavelengths: 172 nm by xenon ...26 KB (3,629 words) - 04:52, 12 July 2024
- ...ither by etching one layer to form a grid pattern of [[electrode]]s, or by etching two separate, parallel layers of conductive material with perpendicular lin ...22 KB (3,105 words) - 12:31, 1 February 2025
- ...ers. It is important for the mask to hold up to chemical attack during the etching process. Photoresists have three major components, a solvent, resin, and se ...14 KB (2,044 words) - 08:27, 24 July 2023
- ...silicon|porosification of silicon]]. Here, the current density during the etching process is selected so that the resulting porosity and thus the refractive ...7 KB (1,076 words) - 21:05, 22 November 2023
- ...SiNW is defined under the nanomask. Then the nanomask is removed with a HF etching and finally the SiNW is connected to the whole circuit using Electron Beam ...16 KB (2,263 words) - 18:02, 5 January 2025
- ...|first4=Dong |last5=Zhang |first5=Pengfei |date=2009-10-06 |title=Chemical etching with tetrafluoroborate: a facile method for resizing of CdTe nanocrystals u ...16 KB (2,204 words) - 05:20, 24 November 2024
- ...alters the chemical structure of the glass allowing it to be selectively [[Etching|etched]]. The glass is also referred to as photomachinable glass. The advan ...8 KB (1,275 words) - 23:45, 27 October 2023
- ...are not affected by the fluorine [[Plasma etching|plasma]], used to [[Dry etching|dry etch]] [[silicon]] and interlevel [[dielectric]]s. The use of built- in ...17 KB (2,490 words) - 16:46, 11 June 2024
- ...tching can be used to create layers of thickness 3 μm or larger, while dry etching techniques can be used to achieve layers on the nanometer scale.<ref>{{Cite ...17 KB (2,467 words) - 15:52, 4 January 2025
- ...ion of scanning tunneling microscopy tips using pulsed alternating current etching |journal=Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Fi |'''[[etching]]''' ...72 KB (10,204 words) - 14:26, 17 August 2024
- Using etching techniques such as [[focused ion beam]] milling, micro- or nano-sized pilla ...9 KB (1,291 words) - 10:12, 22 October 2024
- ...ons with DAST can be carried out in conventional glass equipment, although etching of the glass may result from reaction byproducts. Reactions are typically c ...11 KB (1,487 words) - 22:33, 21 December 2023
- :[[Etching (microfabrication)#Wet etching|Wet-chemically etched]] [[nanowire]]s and a hydrophobic coating on the surf ...27 KB (3,544 words) - 19:36, 8 October 2024